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Package Intersil L24.4x4J

Package Intersil L24.4x4J

ManufacturerIntersil
SeriesTQFN
Part NumberL24.4x4J

24 LEAD THIN QUAD FLAT NO-LEAD PLASTIC PACKAGE

Package Outline Drawing (POD)

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    Plastic Packages for Integrated Circuits Package Outline Drawing
    L24.4x4J
    24 LEAD THIN QUAD FLAT NO-LEAD PLASTIC PACKAGE
    Rev 1, 5/14
    2.50
    4.00 20X 0.50 A
    B 19 6 4.00 R 0.09
    Exp. DAP
    2.70 В± 0.10 2.50 6 13
    (4X) PIN #1
    INDEX AREA
    C0.30 1 18 PIN 1
    INDEX AREA 6 24 0.15 0.10 M C A B
    TOP VIEW 7 12 4 24X 0.25 +0.05
    +0.07 24X 0.40 В± 0.10 0.25 (4 SIDES)
    BOTTOM VIEW SEE DETAIL “X”
    C
    0.10 C 0.75 В± 0.05 0.20 REF 5 C SEATING PLANE
    0.08 C 0.00 MIN
    .05 MAX SIDE VIEW DETAIL "X" (3.80)
    (2.70) NOTES:
    1.
    (20X 0.50) Dimensions are in millimeters. ...

Parametrics

FamilyTQFN
Pin Count24
Length4.00 mm
Width4.00 mm
Thickness0.75 mm
Height max0.80 mm
Weight0.054 g
Pitch0.50 mm
Peak Temperature240 °C
Lead Free Peak Temperature260 °C
Package IndexL24.4X4J

Moldel Line

Series: TQFN (40)

Manufacturer's Classification

  • Plastic Packages
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