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Package Intersil L28.4x4

Package Intersil L28.4x4

ManufacturerIntersil
SeriesTQFN
Part NumberL28.4x4

28 Lead Thin Quad Flat No-Lead Plastic Package

Package Outline Drawing (POD)

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    Plastic Packages for Integrated Circuits Package Outline Drawing
    L28.4x4
    28 LEAD THIN QUAD FLAT NO-LEAD PLASTIC PACKAGE
    Rev 1, 6/15
    A
    2.50 ±0.05 PIN #1 INDEX AREA
    CHAMFER
    0.400 ±0.05 x 45° ±2° 0.40 ±0.05
    22 28 1 2.50 ±0.05 4.00 ±0.05 21 0.40 ±0.05 15 3.20 ±0.05 B PIN 1
    INDEX AREA 0.4 x 6 = 2.40 REF 4.00 ±0.05 7 0.10
    2x 14 8 0.4 x 6 = 2.40 REF
    3.20 ±0.05 TOP VIEW 0.20 ±0.05
    0.10 M C A B BOTTOM VIEW SEE DETAIL X''
    PACKAGE
    OUTLINE 0.10 C (3.20) C
    MAX. 0.80
    (28x 0.20) 0.00 -0.05 0.20 REF SEATING PLANE
    0.08 C (3.20) (2.50) SIDE VIEW (0.40) (0.40) C 0.20 REF 5 0 ~ 0.05
    (2.50) (28x 0.60)
    DETAIL "X" TYPICAL RECOMMENDED LAND PATTERN
    NOTES:
    1. Controlling dimensions are in mm.
    Dimensions in ( ) are for reference only. ...

Parametrics

FamilyTQFN
Pin Count28
Length4.00 mm
Width4.00 mm
Thickness0.75 mm
Height max0.80 mm
Weight0.037 g
Pitch0.40 mm
Peak Temperature240 °C
Lead Free Peak Temperature260 °C
Package IndexL28.4X4

Moldel Line

Series: TQFN (40)

Manufacturer's Classification

  • Plastic Packages
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