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Package Intersil L28.4x5C

Package Intersil L28.4x5C

ManufacturerIntersil
SeriesTQFN
Part NumberL28.4x5C

28 Lead Thin Quad Flat No-Lead Plastic Package

Package Outline Drawing (POD)

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    Plastic Packages for Integrated Circuits Package Outline Drawing
    L28.4x5C
    28 LEAD THIN QUAD FLAT NO-LEAD PLASTIC PACKAGE
    Rev 0, 9/08
    2.50
    4.00 B 22 5.00 PIN #1 INDEX AREA 28 23 6
    PIN 1
    INDEX AREA (4X) 6 24X 0.50 A 1 3.50
    Exp. DAP 3.50 0.10 M C A B
    4
    28X 0.25 0.15 8 15
    9 14
    2.50
    Exp. DAP SIDE VIEW TOP VIEW 28X 0.400 BOTTOM VIEW SEE DETAIL "X"
    ( 3.80 )
    0.10 C Max 0.80 ( 2.50) C SEATING PLANE
    0.08 C SIDE VIEW ( 4.80 ) ( 24X 0.50)
    ( 3.50 )
    C 0 . 2 REF 5 0 . 00 MIN.
    0 . 05 MAX. (28X .250) DETAIL "X" ( 28 X 0.60) TYPICAL RECOMMENDED LAND PATTERN NOTES:
    1. Dimensions are in millimeters.
    Dimensions in ( ) for Reference Only.
    2. Dimensioning and tolerancing conform to AMSE Y14.5m-1994. ...

Parametrics

FamilyTQFN
Pin Count28
Length4.00 mm
Width5.00 mm
Thickness0.75 mm
Weight0.054 g
Peak Temperature240 °C
Lead Free Peak Temperature260 °C
Package IndexL28.4X5C

Moldel Line

Series: TQFN (40)

Manufacturer's Classification

  • Plastic Packages
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