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Package Intersil L32.5x5G

Package Intersil L32.5x5G

ManufacturerIntersil
SeriesTQFN
Part NumberL32.5x5G

32 Lead Quad Flat No-lead Plastic Package

Package Outline Drawing (POD)

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    Plastic Packages for Integrated Circuits Package Outline Drawing
    L32.5x5G
    32 LEAD QUAD FLAT NO-LEAD PLASTIC PACKAGE
    Rev 0, 3/10
    4X 3.5
    5.00 28X 0.50 A
    B 25 6
    PIN 1
    INDEX AREA 32 6
    PIN #1
    INDEX AREA
    1 5.00 24 3 .50
    EXP. DAP 17
    (4X) 8 0.15
    16 9 TOP VIEW
    32X 0.40 В± 0.10 4 32X 0.23
    0.10 M C A B BOTTOM VIEW SEE DETAIL "X"
    0.10 C MAX 1.00
    ( 4. 80 TYP )
    ( C SEATING PLANE
    0.08 C ( 28X 0 . 5 ) SIDE VIEW 3.50 ) (32X 0 . 23 )
    C 0 . 2 REF 5 ( 32X 0 . 60)
    0 . 00 MIN. ...

Parametrics

FamilyTQFN
Pin Count32
Length5.00 mm
Width5.00 mm
Thickness0.75 mm
Height max0.80 mm
Weight0.068 g
Pitch0.50 mm
Peak Temperature240 °C
Lead Free Peak Temperature260 °C
Package IndexL32.5X5G

Moldel Line

Series: TQFN (40)

Manufacturer's Classification

  • Plastic Packages
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