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Package Intersil L32.5x6B

Package Intersil L32.5x6B

ManufacturerIntersil
SeriesQFN
Part NumberL32.5x6B

32 Lead Quad Flat No-Lead Plastic Package

Package Outline Drawing (POD)

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    Plastic Packages for Integrated Circuits
    Quad Flat No-Lead Plastic Package (QFN)
    Micro Lead Frame Plastic Package (MLFP) L32.5x6B (One of 10 Packages in MDP0046)
    32 LEAD QUAD FLAT NO-LEAD PLASTIC PACKAGE
    (COMPLIANT TO JEDEC MO-220) A MILLIMETERS
    D
    N
    (N-1)
    (N-2) B 1
    2
    3 SYMBOL MIN NOMINAL MAX NOTES A 0.80 0.90 1.00 -A1 0.00 0.02 0.05 -D
    PIN #1
    I.D. MARK
    E 5.00 BSC -D2 3.60 REF -E 6.00 BSC -E2 (N/2) 2X
    0.075 C 2X
    0.075 C b L 0.20 0.55 -0.22 0.24 -c 0.20 REF -e 0.50 BSC -N 32 REF 4 ND 7 REF 6 NE 9 REF 5
    Rev 0 9/05 1. Dimensioning and tolerancing per ASME Y14.5M-1994. PIN #1 I.D. 2. Tiebar view shown is a non-functional feature. 3 3. Bottom-side pin #1 I.D. is a diepad chamfer as shown.
    4. N is the total number of terminals on the device.
    5. NE is the number of terminals on the “E” side of the package
    (or Y-direction). (E2) 6. ND is the number of terminals on the “D” side of the package
    (or X-direction). ND = (N/2)-NE. (N/2) NE 5 7. Inward end of terminal may be square or circular in shape with
    radius (b/2) as shown. 7 (D2)
    BOTTOM VIEW 0.10 C C (c) SEATING ...
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