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Package Intersil L32.5x6C

Package Intersil L32.5x6C

ManufacturerIntersil
SeriesQFN
Part NumberL32.5x6C

32 Lead Quad Flat No-Lead Plastic Package

Package Outline Drawing (POD)

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    Plastic Packages for Integrated Circuits
    Quad Flat No-Lead Plastic Package (QFN)
    Micro Lead Frame Plastic Package (MLFP) L32.5x6C (One of 10 Packages in MDP0046)
    32 LEAD QUAD FLAT NO-LEAD PLASTIC PACKAGE
    (COMPLIANT TO JEDEC MO-220) A MILLIMETERS
    D
    N
    (N-1)
    (N-2) B 1
    2
    3 SYMBOL MIN NOMINAL MAX NOTES A 0.80 0.90 1.00 -A1 0.00 0.02 0.05 -D
    PIN #1
    I.D. MARK
    E 5.00 BSC -D2 3.50 REF -E 6.00 BSC -E2 (N/2) 2X
    0.075 C 2X
    0.075 C 0.35 b 0.23 -0.40 0.45 -0.25 0.27 -c 0.20 REF -e 0.50 BSC -N 32 REF 4 ND 7 REF 6 NE 9 REF 5 0.10 M C A B
    b Rev 1, 09/11
    NOTES: (N-2)
    (N-1)
    N N LEADS TOP VIEW 4.50 REF L L 1. Dimensioning and tolerancing per ASME Y14.5M-1994. PIN #1 I.D. 2. Tiebar view shown is a non-functional feature. 3
    1
    2
    3 3. Bottom-side pin #1 I.D. is a diepad chamfer as shown. ...
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