Package Intersil L36.6x6C 
36 Lead Quad Flat No-lead Plastic Package Package Outline Drawing (POD)- Download », PDF, 103 Kb
Docket ↓Plastic Packages for Integrated Circuits Package Outline Drawing
L36.6x6C
36 LEAD QUAD FLAT NO-LEAD PLASTIC PACKAGE
Rev 0, 4/10
4X 4.0
6.00 36X 0.50 A
B 28 6
PIN 1
INDEX AREA 36 27 6
PIN #1
INDEX AREA 6.00 1 4 .10 В± 0.10 9 19
(4X) 0.15
18 10 TOP VIEW
36X 0.60 В± 0.10 36X 0.25 4
0.10 M C A B BOTTOM VIEW SEE DETAIL "X" 0.10 C MAX 1.00 C
0.08 C ( 5. 60 TYP ) ( 36 X 0 . 50 )
SIDE VIEW ( 4. 10 ) (36X 0.25 ) C ( 36X 0.80 ) 0 . 2 REF 5 0 . 00 MIN.
0 . 05 MAX. TYPICAL RECOMMENDED LAND PATTERN DETAIL "X"
NOTES:
1. Dimensions are in millimeters.
Dimensions in ( ) for Reference Only. 2. Dimensioning and tolerancing conform to ASME Y14.5m-1994. 3. Unless otherwise specified, tolerance : Decimal В± 0.05 4. Dimension applies to the metallized terminal and is measured
between 0.15mm and 0.30mm from the terminal tip. 5. Tiebar shown (if present) is a non-functional feature. 6. The configuration of the pin #1 identifier is optional, but must be
located within the zone indicated. The pin #1 identifier may be 7. JEDEC reference drawing: MO-220VJJD. either a mold or mark feature. 1 ...
Parametrics| Family | QFN |
|---|
| Pin Count | 36 |
|---|
| Length | 6.00 mm |
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| Width | 6.00 mm |
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| Thickness | 0.90 mm |
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| Height max | 1.00 mm |
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| Weight | 0.094 g |
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| Pitch | 0.50 mm |
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| Peak Temperature | 240 °C |
|---|
| Lead Free Peak Temperature | 260 °C |
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| Package Index | L36.6X6C |
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Moldel LineSeries: QFN (100 from 124) Manufacturer's Classification |
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