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Package Intersil M24.15

Package Intersil M24.15

ManufacturerIntersil
SeriesQSOP
Part NumberM24.15

24 Lead Shrink Small Outline Plastic Package (QSOP/SSOP)

Package Outline Drawing (POD)

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    Plastic Packages for Integrated Circuits Package Outline Drawing
    M24.15
    24 LEAD SHRINK SMALL OUTLINE PLASTIC PACKAGE (QSOP/SSOP)
    0.150” WIDE BODY
    Rev 3, 2/13
    24
    6.19
    5.80 INDEX
    3.98
    3.81 AREA
    5 4 0.25(0.010) M B M -B-1
    TOP VIEW
    DETAIL “X”
    SEATING PLANE
    -A-8.74
    8.55 3 1.75
    1.35 GAUGE
    PLANE -C-SIDE VIEW 1 1.27
    0.41 0.25
    0.10 0.635 BSC
    7 0.30
    0.20 0.25
    0.010 0.10(0.004) 0.49 ...

Parametrics

FamilyQSOP
Pin Count24
Thickness1.55 mm
Height max1.75 mm
Weight0.135 g
Pitch0.64 mm
Package IndexM24.15

Moldel Line

Series: QSOP (6)

Manufacturer's Classification

  • Plastic Packages
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