28 Lead Shrink Small Outline Plastic Packages
Package Outline Drawing (POD)
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Plastic Packages for Integrated Circuits
Shrink Small Outline Plastic Packages (SSOP)
Quarter Size Outline Plastic Packages (QSOP)
AREA H 0.25(0.010) M E 2 SYMBOL 3
0.010 SEATING PLANE
PLANE -B1 28 LEAD SHRINK SMALL OUTLINE PLASTIC PACKAGE
(0.150вЂќ WIDE BODY) B M A D h x 45В° -C-e О±
A2 A1 B
0.17(0.007) M L C
0.10(0.004) C A M B S NOTES:
1. Symbols are defined in the вЂњMO Series Symbol ListвЂќ in Section 2.2
of Publication Number 95.
2. Dimensioning and tolerancing per ANSI Y14.5M-1982.
3. Dimension вЂњDвЂќ does not include mold flash, protrusions or gate
burrs. Mold flash, protrusion and gate burrs shall not exceed
0.15mm (0.006 inch) per side.
4. Dimension вЂњEвЂќ does not include interlead flash or protrusions. Interlead flash and protrusions shall not exceed 0.25mm (0.010 inch)
5. The chamfer on the body is optional. If it is not present, a visual index feature must be located within the crosshatched area. ...
|Height max||1.75 mm|