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Package Intersil M28.15

Package Intersil M28.15

ManufacturerIntersil
SeriesQSOP
Part NumberM28.15

28 Lead Shrink Small Outline Plastic Packages

Package Outline Drawing (POD)

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    Plastic Packages for Integrated Circuits
    Shrink Small Outline Plastic Packages (SSOP)
    Quarter Size Outline Plastic Packages (QSOP)
    M28.15 N
    INDEX
    AREA H 0.25(0.010) M E 2 SYMBOL 3
    0.25
    0.010 SEATING PLANE
    -A-INCHES GAUGE
    PLANE -B1 28 LEAD SHRINK SMALL OUTLINE PLASTIC PACKAGE
    (0.150” WIDE BODY) B M A D h x 45° -C-e α
    A2 A1 B
    0.17(0.007) M L C
    0.10(0.004) C A M B S NOTES:
    1. Symbols are defined in the “MO Series Symbol List” in Section 2.2
    of Publication Number 95.
    2. Dimensioning and tolerancing per ANSI Y14.5M-1982.
    3. Dimension “D” does not include mold flash, protrusions or gate
    burrs. Mold flash, protrusion and gate burrs shall not exceed
    0.15mm (0.006 inch) per side.
    4. Dimension “E” does not include interlead flash or protrusions. Interlead flash and protrusions shall not exceed 0.25mm (0.010 inch)
    per side.
    5. The chamfer on the body is optional. If it is not present, a visual index feature must be located within the crosshatched area. ...

Parametrics

FamilyQSOP
Pin Count28
Thickness1.55 mm
Height max1.75 mm
Weight0.152 g
Pitch0.64 mm
Package IndexM28.15

Moldel Line

Series: QSOP (6)

Manufacturer's Classification

  • Plastic Packages
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