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Package Intersil M16.3

Package Intersil M16.3

ManufacturerIntersil
SeriesSOIC
Part NumberM16.3

16 Lead Wide Body Small Outline Plastic Package  

Package Outline Drawing (POD)

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    Plastic Packages for Integrated Circuits
    Small Outline Plastic Packages (SOIC)
    M16.3 (JEDEC MS-013-AA ISSUE C) N
    INDEX
    AREA 16 LEAD WIDE BODY SMALL OUTLINE PLASTIC PACKAGE
    H 0.25(0.010) M B M INCHES E
    -B-1 2 3 L
    SEATING PLANE -A-A D h x 45° -C-e A1 B
    0.25(0.010) M C
    0.10(0.004) C A M SYMBOL MIN MAX MIN MAX NOTES A 0.0926 0.1043 2.35 2.65 -A1 0.0040 0.0118 0.10 0.30 -B 0.013 0.0200 0.33 0.51 9 C 0.0091 0.0125 0.23 0.32 -D 0.3977 0.4133 10.10 10.50 3 E 0.2914 0.2992 7.40 7.60 4 e α B S 0.050 BSC 2. Dimensioning and tolerancing per ANSI Y14.5M-1982.
    3. Dimension “D” does not include mold flash, protrusions or gate burrs.
    Mold flash, protrusion and gate burrs shall not exceed 0.15mm (0.006
    inch) per side.
    4. Dimension “E” does not include interlead flash or protrusions. Interlead
    flash and protrusions shall not exceed 0.25mm (0.010 inch) per side.
    5. The chamfer on the body is optional. If it is not present, a visual index
    feature must be located within the crosshatched area.
    6. “L” is the length of terminal for soldering to a substrate.
    7. “N” is the number of terminal positions.
    8. Terminal numbers are shown for reference only.
    9. The lead width “B”, as measured 0.36mm (0.014 inch) or greater above
    the seating plane, shall not exceed a maximum value of 0.61mm (0.024
    inch) ...

Parametrics

FamilySOICW
Pin Count16
Thickness0.20 mm
Height max2.65 mm
Weight0.45 g
Pitch1.27 mm
FeaturesWide
Package IndexM16.3

Moldel Line

Series: SOIC (17)

Manufacturer's Classification

  • Plastic Packages
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