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Package Intersil M20.3

Package Intersil M20.3

ManufacturerIntersil
SeriesSOIC
Part NumberM20.3

20 Lead Wide Body Small Outline Plastic Package

Package Outline Drawing (POD)

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    Plastic Packages for Integrated Circuits Package Outline Drawing
    M20.3
    20 LEAD WIDE BODY SMALL OUTLINE PLASTIC PACKAGE (SOIC)
    Rev 3, 2/11 20
    INDEX
    AREA
    7.60
    7.40 1 2 10.65
    10.00 0.25 (0.10) M B M 3 3
    TOP VIEW 13.00
    12.60 SEATING PLANE 2
    2.65
    2.35 5 0.75
    1.27
    BSC 0.49
    0.35 7
    0.25 (0.10) M 0.25 0.30
    MAX C A M B S 1.27
    0.40 x 45В° 8В°
    MAX 0.10 (0.004) SIDE VIEW DETAIL "X" 0.32
    0.23 NOTES:
    1. Dimensioning and tolerancing per ASME Y14.5M-1994.
    (0.60) 1.27 BSC 2. Dimension does not include mold flash, protrusions or gate ...

Parametrics

FamilySOICW
Pin Count20
Length12.85 mm
Thickness2.21 mm
Weight0.5555 g
Pitch1.27 mm
FeaturesWide
Package IndexM20.3

Moldel Line

Series: SOIC (17)

Manufacturer's Classification

  • Plastic Packages
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