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Package Intersil M28.3

Package Intersil M28.3

ManufacturerIntersil
SeriesSOIC
Part NumberM28.3

28 Lead Wide Body Small Outline Plastic Package

Package Outline Drawing (POD)

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    Plastic Packages for Integrated Circuits
    Small Outline Plastic Packages (SOIC)
    M28.3 (JEDEC MS-013-AE ISSUE C) N 28 LEAD WIDE BODY SMALL OUTLINE PLASTIC PACKAGE INDEX
    AREA H 0.25(0.010) M B M INCHES E SYMBOL
    -B-1 2 3 L
    SEATING PLANE -A-A D h x 45o a
    e A1 B C
    0.10(0.004) 0.25(0.010) M C A M B S MAX MILLIMETERS
    MIN MAX NOTES A 0.0926 0.1043 2.35 2.65 -A1 0.0040 0.0118 0.10 0.30 -B 0.013 0.0200 0.33 0.51 9 C 0.0091 0.0125 0.23 0.32 -D 0.6969 0.7125 17.70 18.10 3 E 0.2914 0.2992 7.40 7.60 4 e -C-MIN 0.05 BSC h 0.01 0.029 0.25 0.75 5 L 0.016 0.050 0.40 1.27 6 О± 10.00 -0.394 N 0.419 1.27 BSC H 28
    0o 10.65 -28
    8o 0o 7
    8o Rev. 1, 1/13 NOTES:
    1. Symbols are defined in the “MO Series Symbol List” in Section 2.2 of
    Publication Number 95.
    2. Dimensioning and tolerancing per ANSI Y14.5M-1982.
    3. Dimension “D” does not include mold flash, protrusions or gate burrs.
    Mold flash, protrusion and gate burrs shall not exceed 0.15mm (0.006
    inch) per side. TYPICAL RECOMMENDED LAND PATTERN
    (1.50mm) 4. Dimension “E” does not include interlead flash or protrusions. Interlead
    flash and protrusions shall not exceed 0.25mm (0.010 inch) per side.
    5. The chamfer on the body is optional. If it is not present, a visual index
    feature must be located within the crosshatched area. (9.38mm) 6. “L” is the length of terminal for soldering to a substrate.
    7. “N” is the number of terminal positions. ...

Parametrics

FamilySOICW
Thickness0.20 mm
Height max2.65 mm
Weight0.75 g
Pitch1.27 mm
FeaturesWide
Package IndexM28.3

Moldel Line

Series: SOIC (17)

Manufacturer's Classification

  • Plastic Packages
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