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Package Intersil M16.209

Package Intersil M16.209

ManufacturerIntersil
SeriesSSOP
Part NumberM16.209

16 Lead Shrink Small Outline Plastic Package

Package Outline Drawing (POD)

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    Plastic Packages for Integrated Circuits
    Small Outline Plastic Packages (SSOP)
    M16.209 (JEDEC MO-150-AC ISSUE B) N
    INDEX
    AREA 16 LEAD SHRINK SMALL OUTLINE PLASTIC PACKAGE
    H 0.25(0.010) M 2 GAUGE
    PLANE 3
    0.25
    0.010 SEATING PLANE
    -A-INCHES E
    -B-1 B M A D
    -C-e О±
    C
    0.10(0.004) C A M SYMBOL MIN MAX MIN MAX NOTES A -0.078 -2.00 -A1 0.002 -0.05 -A2 0.065 0.072 1.65 1.85 -B 0.009 0.014 0.22 0.38 9 C 0.004 0.009 0.09 0.25 -D 0.233 0.255 5.90 6.50 3 E 0.197 0.220 5.00 5.60 4 e A2 A1 B
    0.25(0.010) M L B S 0.026 BSC H 0.292 L 0.022 N О± NOTES:
    1. Symbols are defined in the “MO Series Symbol List” in Section 2.2 of
    Publication Number 95.
    2. Dimensioning and tolerancing per ANSI Y14.5M-1982.
    3. Dimension “D” does not include mold flash, protrusions or gate burrs.
    Mold flash, protrusion and gate burrs shall not exceed 0.20mm (0.0078
    inch) per side.
    4. Dimension “E” does not include interlead flash or protrusions. Interlead
    flash and protrusions shall not exceed 0.20mm (0.0078 inch) per side. ...

Parametrics

FamilySSOP
Pin Count16
Length6.20 mm
Thickness1.75 mm
Height max1.05 mm
Weight0.14 g
Pitch0.65 mm
Peak Temperature240 °C
Package IndexM16.209

Moldel Line

Series: SSOP (4)

Manufacturer's Classification

  • Plastic Packages
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