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Package Intersil M20.209

Package Intersil M20.209

ManufacturerIntersil
SeriesSSOP
Part NumberM20.209

20 Lead Shrink Small Outline Plastic Package

Package Outline Drawing (POD)

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    Plastic Packages for Integrated Circuits
    Shrink Small Outline Plastic Packages (SSOP)
    M20.209 (JEDEC MO-150-AE ISSUE B) N 20 LEAD SHRINK SMALL OUTLINE PLASTIC PACKAGE INDEX
    AREA H 0.25(0.010) M B M INCHES E
    -B1 2 3
    0.25
    0.010 SEATING PLANE
    -A-SYMBOL GAUGE
    PLANE A D
    -C-α e C
    0.10(0.004) C A M B S MILLIMETERS
    MIN MAX NOTES A 0.068 0.078 1.73 1.99 0.002 0.008’ 0.05 0.21 A2 0.066 0.070’ 1.68 1.78 B 0.010’ 0.015 0.25 0.38 C 0.004 0.008 0.09 0.20’ D 0.278 0.289 7.07 7.33 3 E 0.205 0.212 5.20’ 5.38 4 0.026 BSC
    0.301 0.311 7.65 7.90’ L 0.025 0.037 0.63 0.95 8 deg. 0 deg. α 20
    0 deg. 9 0.65 BSC H N NOTES: MAX A1 e A2 A1 B
    0.25(0.010) M L MIN 6 20 7
    8 deg.
    Rev. 3 11/02 1. Symbols are defined in the “MO Series Symbol List” in Section
    2.2 of Publication Number 95.
    2. Dimensioning and tolerancing per ANSI Y14.5M-1982.
    3. Dimension “D” does not include mold flash, protrusions or gate
    burrs. Mold flash, protrusion and gate burrs shall not exceed
    0.20mm (0.0078 inch) per side.
    4. Dimension “E” does not include interlead flash or protrusions. Interlead flash and protrusions shall not exceed 0.20mm (0.0078 ...

Parametrics

FamilySSOP
Pin Count20
Thickness1.73 mm
Height max2.00 mm
Weight0.151 g
Pitch0.65 mm
Package IndexM20.209

Moldel Line

Series: SSOP (4)

Manufacturer's Classification

  • Plastic Packages
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