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Package Intersil M24.209

Package Intersil M24.209

ManufacturerIntersil
SeriesSSOP
Part NumberM24.209

24 Lead Shrink Small Outline Plastic Package

Package Outline Drawing (POD)

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    Plastic Packages for Integrated Circuits
    Shrink Small Outline Plastic Packages (SSOP)
    M24.209 (JEDEC MO-150-AG ISSUE B) N 24 LEAD SHRINK SMALL OUTLINE PLASTIC PACKAGE INDEX
    AREA H 0.25(0.010) M B M INCHES E
    GAUGE
    PLANE -B1 2 3
    L
    0.25
    0.010 SEATING PLANE
    -A-A D
    -C-О± e
    B
    0.25(0.010) M C
    0.10(0.004) C A M SYMBOL MIN MAX MIN MAX NOTES A -0.078 -2.00 -A1 0.002 0.05 -A2 0.065 1.65 1.85 -B S 46 0.072 B 0.009 0.014 0.22 0.38 9 0.004 0.009 0.09 0.25 -D 0.312 0.334 7.90 8.50 3 E 0.197 0.220 5.00 5.60 4 0.026 BSC H 0.292 L 0.022 N О±
    NOTES:
    1. Symbols are defined in the “MO Series Symbol List” in Section 2.2 of
    Publication Number 95.
    2. Dimensioning and tolerancing per ANSI Y14.5M-1982.
    3. Dimension “D” does not include mold flash, protrusions or gate burrs.
    Mold flash, protrusion and gate burrs shall not exceed 0.20mm
    (0.0078 inch) per side.
    4. Dimension “E” does not include interlead flash or protrusions. Interlead flash and protrusions shall not exceed 0.20mm (0.0078 inch) per
    side. ...

Parametrics

FamilySSOP
Pin Count24
Length8.20 mm
Thickness1.75 mm
Height max2.00 mm
Weight0.176 g
Pitch0.65 mm
Package IndexM24.209

Moldel Line

Series: SSOP (4)

Manufacturer's Classification

  • Plastic Packages
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