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Package Intersil L12.3x3Z

Package Intersil L12.3x3Z

ManufacturerIntersil
SeriesTQFN
Part NumberL12.3x3Z

12 Lead Thin Quad Flat No Lead Plastic Package ***For ISL99202 USE ONLY***

Package Outline Drawing (POD)

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    Plastic Packages for Integrated Circuits Package Outline Drawing
    L12.3x3Z
    12 LEAD THIN QUAD FLAT NO LEAD PLASTIC PACKAGE FOR ISL99202 USE ONLY WITH REDUCED e-PAD SIZE TO 1.4mm ON LAND PATTERN
    Rev 0, 10/08
    3.00 0.5
    BSC A
    B 6
    12 10 PIN #1 INDEX AREA 6 3.00 4X 1.70 REF PIN 1
    INDEX AREA
    9 1 7
    3
    0.10 M C A B
    (4X) 0.15 4
    6 0.25 +0.07 / -0.05 4 12X 0 . 4 В± 0 . 1 TOP VIEW BOTTOM VIEW SEE DETAIL "X"
    0.10 C 0 . 75 C BASE PLANE ( 2 . 8 TYP )
    1.40 ) SEATING PLANE
    0.08 C ( SIDE VIEW 0.6 C 0 . 50 0 . 2 REF 5 0 . 00 MIN.
    0 . 05 MAX. 0 . 25 TYPICAL RECOMMENDED LAND PATTERN DETAIL "X" NOTES:
    1. Dimensions are in millimeters.
    Dimensions in ( ) for Reference Only.
    2. Dimensioning and tolerancing conform to JEDEC STD MO-229.
    3. Unless otherwise specified, tolerance : Decimal В± 0.05
    4. Dimension b applies to the metallized terminal and is measured ...

Parametrics

FamilyTQFN
Pin Count12
Length3.00 mm
Width3.00 mm
Thickness0.75 mm
Weight0.02 g
Pitch0.50 mm
Peak Temperature240 °C
Lead Free Peak Temperature260 °C
Package IndexL12.3X3Z

Moldel Line

Series: TQFN (40)

Manufacturer's Classification

  • Plastic Packages
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