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Package Intersil L16.3x3D

Package Intersil L16.3x3D

ManufacturerIntersil
SeriesTQFN
Part NumberL16.3x3D

16 Lead Thin Quad Flat No-lead Plastic Package

Package Outline Drawing (POD)

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    Plastic Packages for Integrated Circuits Package Outline Drawing
    L16.3x3D
    16 LEAD THIN QUAD FLAT NO-LEAD PLASTIC PACKAGE
    Rev 0, 3/10
    4X 1.50
    3.00 A 12X 0.50 B 13 6
    PIN 1
    INDEX AREA 16 6
    PIN #1
    INDEX AREA 12
    3.00 1 1.60 SQ 4 9
    (4X) 0.15
    0.10 M C A B 5 8
    16X 0.40В±0.10
    TOP VIEW 4 16X 0.23 В±0.05
    BOTTOM VIEW SEE DETAIL “X” 0.10 C
    0.75 В±0.05 C
    0.08 C SIDE VIEW (12X 0.50)
    (2.80 TYP) ( 1.60)
    (16X 0.23)
    C 0 . 2 REF 5 0 . 02 NOM.
    0 . 05 MAX. (16X 0.60)
    TYPICAL RECOMMENDED LAND PATTERN DETAIL "X" ...

Parametrics

FamilyTQFN
Pin Count16
Length3.00 mm
Width3.00 mm
Thickness0.75 mm
Height max0.80 mm
Weight0.024 g
Pitch0.50 mm
Peak Temperature240 °C
Lead Free Peak Temperature260 °C
Package IndexL16.3X3D

Moldel Line

Series: TQFN (40)

Manufacturer's Classification

  • Plastic Packages
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