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Package Intersil L24.4x5C

Package Intersil L24.4x5C

ManufacturerIntersil
SeriesTQFN
Part NumberL24.4x5C

24 Lead Thin Quad Flat No-Lead Plastic Package

Package Outline Drawing (POD)

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    Plastic Packages for Integrated Circuits Package Outline Drawing
    L24.4x5C
    24 LEAD THIN QUAD FLAT NO-LEAD PLASTIC PACKAGE
    Rev 1, 10/07
    4.00 PIN 1 A 2.65 24X0.40 PIN #1 INDEX AREA
    CHAMFER 0.400
    Г— X 45В° INDEX AREA
    B 6 20 24 6
    1
    0.50 19 5.00 3.65 0.5x6=3.00 REF 7 13 12 0.10 8
    0.23В±0.05 4X 0.50 TOP VIEW 0.10 M C A B 0.5x4=2.00 REF BOTTOM VIEW SEE DETAIL X''
    0.10 C
    C
    0.75 SEATING PLANE
    0.08 C (24x0.25)
    SIDE VIEW
    (4.80 TYP) (3.65) (20x0.50) 0 . 20 REF 5 C
    (24x0.60)
    (2.65)
    (3.80 TYP) 0 . 00 MIN.
    0 . 05 MAX. TYPICAL RECOMMENDED LAND PATTERN DETAIL "X" NOTES:
    1. Dimensions are in millimeters.
    Dimensions in ( ) for Reference Only. ...

Parametrics

FamilyTQFN
Pin Count24
Width4.00 mm
Thickness0.75 mm
Height max0.75 mm
Weight0.049 g
Pitch0.50 mm
Peak Temperature240 °C
Lead Free Peak Temperature260 °C
Package IndexL24.4X5C

Moldel Line

Series: TQFN (40)

Manufacturer's Classification

  • Plastic Packages
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