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Package Intersil L32.4x4

Package Intersil L32.4x4

ManufacturerIntersil
SeriesTQFN
Part NumberL32.4x4

32 Lead Thin Quad Flat No-lead Plastic Package

Package Outline Drawing (POD)

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    Plastic Packages for Integrated Circuits Package Outline Drawing
    L32.4x4
    32 LEAD THIN QUAD FLAT NO-LEAD PLASTIC PACKAGE
    Rev 0, 2/10
    6
    PIN 1
    INDEX AREA 4.00 A 2.80
    28X 0.40 B 6
    PIN #1 INDEX AREA 32
    1 2.70 4.00 24 17
    (4X) 8 0.15 16 32X 0.40 TOP VIEW b 32X 0.20 0.10 M C A B BOTTOM VIEW SEE DETAIL "X" (2.70) 0.05 (3.80) // 0.10 C
    C
    BASE PLANE
    SEATING PLANE
    0.08 C 0.75 (3.80)
    (2.80) SIDE VIEW (28X 0.40) C (32X 0.20) 5 0.2 REF 0.00 MIN
    0.05 MAX (32X 0.60)
    TYPICAL RECOMMENDED LAND PATTERN DETAIL "X" NOTES:
    1. Dimensions are in millimeters.
    Dimensions in ( ) for Reference Only. 2. Dimensioning and tolerancing conform to ASME Y14.5m-1994. 3. Unless otherwise specified, tolerance : Decimal В± 0.05 4. Dimension b applies to the metallized terminal and is measured
    between 0.15mm and 0.25mm from the terminal tip. 5. Tiebar shown (if present) is a non-functional feature. 6. The configuration of the pin #1 identifier is optional, but must be
    located within the zone indicated. The pin #1 indentifier may be
    either a mold or mark feature. 1 ...

Parametrics

FamilyTQFN
Pin Count32
Length4.00 mm
Width4.00 mm
Thickness0.75 mm
Height max0.80 mm
Weight0.043 g
Pitch0.40 mm
Peak Temperature240 °C
Lead Free Peak Temperature260 °C
Package IndexL32.4X4

Moldel Line

Series: TQFN (40)

Manufacturer's Classification

  • Plastic Packages
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