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Package Intersil L32.4x4D

Package Intersil L32.4x4D

ManufacturerIntersil
SeriesTQFN
Part NumberL32.4x4D

32 LEAD THIN QUAD FLAT NO-LEAD PLASTIC PACKAGE

Package Outline Drawing (POD)

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    Plastic Packages for Integrated Circuits Package Outline Drawing
    L32.4x4D
    32 LEAD THIN QUAD FLAT NO-LEAD PLASTIC PACKAGE
    Rev 2, 10/16
    2.80
    4.00 A 6
    PIN 1
    INDEX AREA 6
    PIN #1
    INDEX AREA 28X 0.40 B 4.00 (4X) 2.70 В±0.10 0.10
    32X 0.30
    TOP VIEW BOTTOM VIEW b 32X 0.20
    4 0.10 M C A B (3.90 TYP)
    (2.80) 0.75 SEE DETAIL “X” // 0.10 C
    BASE PLANE C SEATING PLANE
    0.08 C
    SIDE VIEW
    ( 2.70)
    (28X 0.40) 5 C
    (32X 0.20)
    (32X 0.50) 0.2 REF 0.00 MIN
    0.05 MAX
    0.035 NOMINAL TYPICAL RECOMMENDED LAND PATTERN ...

Parametrics

FamilyTQFN
Pin Count32
Length4.00 mm
Width4.00 mm
Thickness0.70 mm
Height max0.75 mm
Weight0.05 g
Pitch0.40 mm
Peak Temperature240 °C
Lead Free Peak Temperature260 °C
Package IndexL32.4X4D

Moldel Line

Series: TQFN (40)

Manufacturer's Classification

  • Plastic Packages
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