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Package Intersil L32.4x5A

Package Intersil L32.4x5A

ManufacturerIntersil
SeriesTQFN
Part NumberL32.4x5A

32 Lead Thin Quad Flat No-Lead Plastic Package

Package Outline Drawing (POD)

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    Plastic Packages for Integrated Circuits
    Thin Quad Flat No-Lead Plastic Package (TQFN)
    Micro Lead Frame Plastic Package (MLFP)
    L32.4x5A A 32 LEAD THIN QUAD FLAT NO-LEAD PLASTIC PACKAGE
    (COMPLIANT TO JEDEC MO-220) D
    N
    (N-1)
    (N-2) B MILLIMETERS
    SYMBOL 1
    2
    3 PIN #1
    I.D. MARK
    E (N/2) 2X
    0.075 C 2X
    0.075 C 0.10 M C A B
    b (N-2)
    (N-1)
    N N LEADS TOP VIEW L MIN NOMINAL MAX NOTES A 0.70 0.75 0.80 -A1 0.00 0.02 0.05 -D 4.00 BSC -D2 2.50 REF -E 5.00 BSC -E2 3.50 REF -L 0.35 0.40 0.45 -b 0.15 0.20 0.25 -c 0.20 REF -e 0.40 BSC -N 32 REF 4 ND 7 REF 6 NE 9 REF PIN #1 I.D. 5
    Rev 2 8/06 3 NOTES: 1
    2
    3 1. Dimensioning and tolerancing per ASME Y14.5M-1994.
    2. Tiebar view shown is a non-functional feature.
    3. Bottom-side pin #1 I.D. is a diepad chamfer as shown. (E2) 4. N is the total number of terminals on the device. ...

Parametrics

FamilyTQFN
Pin Count32
Length4.00 mm
Width5.00 mm
Thickness0.75 mm
Peak Temperature240 °C
Lead Free Peak Temperature260 °C
Package IndexL32.4X5A

Moldel Line

Series: TQFN (40)

Manufacturer's Classification

  • Plastic Packages
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