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Package Intersil L32.5x5F

Package Intersil L32.5x5F

ManufacturerIntersil
SeriesTQFN
Part NumberL32.5x5F

32 Lead Thin Quad Flat No-lead Plastic Package

Package Outline Drawing (POD)

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    Plastic Packages for Integrated Circuits Package Outline Drawing
    L32.5x5F
    32 LEAD THIN QUAD FLAT NO-LEAD PLASTIC PACKAGE
    Rev 0, 9/09
    4X 3.5
    5.00 28X 0.50 A
    B 6
    PIN 1
    INDEX AREA 6
    PIN #1 INDEX AREA 32 25 1 5.00 24 3 .30 В± 0 . 15 17
    (4X) 8 0.15
    9 16 TOP VIEW 0.10 M C A B
    + 0.07 32X 0.045 В± 0.10 4 32X 0.23 -0.05 BOTTOM VIEW SEE DETAIL "X"
    0.10 C 0 . 75 В± 0.05 SEATING PLANE
    0.08 C ( 4. 80 TYP )
    ( C BASE PLANE ( 28X 0 . 5 ) SIDE VIEW 3. 30 ) (32X 0 . 23 ) C 0 . 2 REF 5 ( 32X 0 . 65)
    0 . 00 MIN.
    0 . 05 MAX. DETAIL "X" TYPICAL RECOMMENDED LAND PATTERN NOTES:
    1. Dimensions are in millimeters.
    Dimensions in ( ) for Reference Only.
    2. Dimensioning and tolerancing conform to AMSE Y14.5m-1994.
    3. Unless otherwise specified, tolerance : Decimal В± 0.05
    4. Dimension b applies to the metallized terminal and is measured ...

Parametrics

FamilyTQFN
Pin Count32
Length5.00 mm
Width5.00 mm
Thickness0.75 mm
Height max0.80 mm
Weight0.07 g
Pitch0.50 mm
Peak Temperature240 °C
Lead Free Peak Temperature260 °C
Package IndexL32.5X5F

Moldel Line

Series: TQFN (40)

Manufacturer's Classification

  • Plastic Packages
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