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Package Intersil Q32.5x5

Package Intersil Q32.5x5

ManufacturerIntersil
SeriesTQFP
Part NumberQ32.5x5

32 Lead Thin Plastic Quad Flatpack Package

Package Outline Drawing (POD)

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    Plastic Packages for Integrated Circuits
    Thin Plastic Quad Flatpack Packages (TQFP)
    Q32.5x5 (JEDEC MS-026AAA ISSUE B)
    32 LEAD THIN PLASTIC QUAD FLATPACK PACKAGE
    MILLIMETERS D
    D1
    -D-B-A-E E1 e
    PIN 1
    SEATING
    A PLANE -H-0.08
    0.003
    -C-SYMBOL MIN MAX NOTES A -1.20 -A1 0.05 0.15 -A2 0.95 1.05 -b 0.17 0.27 6 b1 0.17 0.23 -D 6.90 7.10 3 D1 4.90 5.10 4, 5 E 6.90 7.10 3 E1 4.90 5.10 4, 5 L 0.45 0.75 N 32 e 0.50 BSC 7
    Rev. 0 2/07 NOTES:
    1. Controlling dimension: MILLIMETER. Converted inch
    dimensions are not necessarily exact.
    2. All dimensions and tolerances per ANSI Y14.5M-1982.
    3. Dimensions D and E to be determined at seating plane -C-. 0.08
    0.003 M C A-B S 11o-13o
    0.020
    0.008 MIN b 5. Dimensions D1 and E1 do not include mold protrusion. Allowable
    protrusion is 0.25mm (0.010 inch) per side. 0.09/0.16
    A2 A1 0.004/0.006 GAGE
    PLANE 11o-13o 1 6. Dimension b does not include dambar protrusion. Allowable dambar protrusion shall not cause the lead width to exceed the maximum b dimension by more than 0.08mm (0.003 inch). ...

Parametrics

FamilyTQFP
Pin Count32
Length5.00 mm
Width5.00 mm
Thickness1.00 mm
Height max1.20 mm
Weight0.07 g
Pitch0.50 mm
Peak Temperature240 °C
Lead Free Peak Temperature260 °C
Package IndexQ32.5X5

Moldel Line

Series: TQFP (16)

Manufacturer's Classification

  • Plastic Packages
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