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Package Intersil Q32.7x7

Package Intersil Q32.7x7

ManufacturerIntersil
SeriesTQFP
Part NumberQ32.7x7

32 Lead Thin Plastic Quad Flatpack Package

Package Outline Drawing (POD)

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    Plastic Packages for Integrated Circuits
    Thin Plastic Quad Flatpack Packages (TQFP)
    Q32.7x7 (JEDEC MS-026ABA ISSUE B)
    32 LEAD THIN PLASTIC QUAD FLATPACK PACKAGE
    INCHES D
    D1
    -D-B-A-E E1 e
    PIN 1
    SEATING
    A PLANE -H-0.08
    0.003
    -C-MILLIMETERS SYMBOL MIN MAX MIN MAX NOTES A -0.047 -1.20 -A1 0.002 0.005 0.05 0.15 -A2 0.038 0.041 0.95 1.05 -b 0.012 0.018 0.30 0.45 6 b1 0.012 0.016 0.30 0.40 -D 0.350 0.358 8.90 9.10 3 D1 0.272 0.280 6.90 7.10 4, 5 E 0.350 0.358 8.90 9.10 3 E1 0.272 0.280 6.90 7.10 4, 5 L 0.018 0.029 0.45 0.75 N 32 32 e 0.031 BSC 0.80 BSC 7
    Rev. 0 10/06 NOTES:
    1. Controlling dimension: MILLIMETER. Converted inch
    dimensions are not necessarily exact.
    2. All dimensions and tolerances per ANSI Y14.5M-1982.
    3. Dimensions D and E to be determined at seating plane -C-. 0.08
    0.003 M D S C A-B S b 11o-13o
    0.020
    0.008 MIN b1 0o MIN
    A2 A1 GAGE
    PLANE 0o-7o 0.25
    0.010 11o-13o 1 5. Dimensions D1 and E1 do not include mold protrusion. ...

Parametrics

FamilyTQFP
Pin Count32
Thickness1.00 mm
Height max1.20 mm
Weight0.178 g
Pitch0.80 mm
Peak Temperature240 °C
Lead Free Peak Temperature260 °C
Package IndexQ32.7X7

Moldel Line

Series: TQFP (16)

Manufacturer's Classification

  • Plastic Packages
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