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Package Intersil Q48.7x7B

Package Intersil Q48.7x7B

ManufacturerIntersil
SeriesTQFP
Part NumberQ48.7x7B

48 Lead Thin Plastic Quad Flatpack Exposed Pad Package

Package Outline Drawing (POD)

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    Plastic Packages for Integrated Circuits Package Outline Drawing
    Q48.7x7B
    48 LEAD THIN PLASTIC QUAD FLATPACK EXPOSED PAD PACKAGE
    Rev 2, 7/10
    9.0±0.20
    4 5
    7.0±0.10 D 3 A 3 7.0±0.10 9.0±0.20 4 5 4.00±0.1 0.50 B
    3 TOP VIEW EXPOSED PAD
    4.00±0.1
    1.20 MAX 11/13° C BOTTOM VIEW 0.08
    0° MIN. SEE DETAIL "A" 0.08 M C A-B D H 0.17/0.27 WITH LEAD FINISH 7 0.09/0.20 0.09/0.16 2 1.00 ±0.05 0.05/0.15 0.25
    GAUGE
    PLANE
    0.60 ±0.15
    0-7° 0.20 MIN.
    0.17/0.23
    (1.00) BASE METAL
    DETAIL "A"
    (10.00)
    (0.28) TYP NOTES:
    1. All dimensioning and tolerancing conform to ANSI Y14.5-1982.
    2. Datum plane H located at mold parting line and coincident
    with lead, where lead exits plastic body at bottom of parting line. (10.00) ...

Parametrics

FamilyTQFP-EP
Pin Count48
Height max1.05 mm
Weight0.174 g
Pitch0.50 mm
Peak Temperature240 °C
Lead Free Peak Temperature260 °C
FeaturesExposed Pad
Package IndexQ48.7X7B

Moldel Line

Series: TQFP (16)

Manufacturer's Classification

  • Plastic Packages

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