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Package Intersil Q64.10x10C

Package Intersil Q64.10x10C

ManufacturerIntersil
SeriesTQFP
Part NumberQ64.10x10C

64 Lead Thin Plastic Quad Flatpack Exposed Pad Package

Package Outline Drawing (POD)

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    Plastic Packages for Integrated Circuits
    Thin Plastic Quad Flatpack Exposed Pad Plastic Packages (EPTQFP)
    Q64.10x10C (JEDEC MS-026ACD-HU ISSUE D)
    64 LEAD THIN PLASTIC QUAD FLATPACK EXPOSED
    PAD PACKAGE D
    D1
    -D-MILLIMETERS
    SYMBOL
    EJECTOR PIN MARK
    NOT PIN #1 ID
    -B-A-E E1 e PIN 1
    TOP VIEW MIN MAX NOTES A -1.20 -A1 0.05 0.15 -A2 0.95 1.05 -b 0.16 0.28 6 b1 0.17 0.23 -D 11.80 12.20 3 D1 9.90 10.10 4, 5 D2 2.90 3.10 -E 11.80 12.20 3 E1 9.90 10.10 4, 5 E2 2.90 3.10 -L 0.45 0.75 -N 64 7 e 0.50 BSC Rev. 0 10/08 NOTES: 11o-13o
    0.020
    0.008 MIN 1. Controlling dimension: MILLIMETER. Converted inch
    dimensions are not necessarily exact. 0o MIN 2. All dimensions and tolerances per ANSI Y14.5M-1982. A2 A1 GAGE
    PLANE
    0o-7o
    L 3. Dimensions D and E to be determined at seating plane -C-.
    4. Dimensions D1 and E1 to be determined at datum plane
    -H-. 11o-13o 5. Dimensions D1 and E1 do not include mold protrusion.
    Allowable protrusion is 0.25mm (0.010 inch) per side. 0.25
    0.010 6. Dimension b does not include dambar protrusion. Allowable
    dambar protrusion shall not cause the lead width to exceed ...

Parametrics

FamilyTQFP-EP
Pin Count64
Thickness1.00 mm
Height max1.20 mm
Weight0.28 g
Pitch0.50 mm
Lead Free Peak Temperature260 °C
FeaturesExposed Pad
Package IndexQ64.10X10C

Moldel Line

Series: TQFP (16)

Manufacturer's Classification

  • Plastic Packages
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