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Package Intersil Q64.10x10E

Package Intersil Q64.10x10E

ManufacturerIntersil
SeriesTQFP
Part NumberQ64.10x10E

64 Lead Thin Plastic Quad Flatpack Package With Top Exposed Pad (TQFP-TEP)

Package Outline Drawing (POD)

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    Plastic Packages for Integrated Circuits
    Thin Plastic Quad Flatpack Package with Top Exposed Pad (TQFP-TEP)
    5
    D1 Q64.10x10E 7 64 LEAD THIN PLASTIC QUAD FLATPACK PACKAGE WITH
    TOP EXPOSED PAD (TQFP-TEP) D1/2 ACD
    SYMBOL 7
    E1
    D2 13 4X NOM. MAX A E1/2
    5 MIN 0.20 H A-B D E2 13 1.20 A1 0.05 A2 0.95 A
    -H-0.05 2 / / 0.10 C ccc
    -C-SIDE VIEW SEE DETAIL "B"
    4
    D 1.00 12 1.05 12.00 BSC 4 D1 10.00 BSC 7, 8 D2 7.49 BSC 13 E 12.00 BSC 4 E1 10.00 BSC 7, 8 L
    11/13В° 0.15 D E2 TOP VIEW NOTES 7.49 BSC
    0.45 13 0.60 N 64 e 0.50 BSC 0.75 b 0.17 0.22 0.27 b1 0.17 0.20 0.23 ccc 0.08 ddd 0.08 9 D/2
    -D-Rev. 1 7/11 3 NOTES: -A-3 4
    E
    -Be 3
    E/2 N/4 TIPS
    0.20 C A-B D
    4X SEE DETAIL "A"
    8 PLACES BOTTOM VIEW
    0В° MIN. -0.05 S 0.08/0.20 R. DATUM ...

Parametrics

FamilyTQFP-TEP
Pin Count64
Thickness1.00 mm
Height max1.20 mm
Weight0.28917 g
Pitch0.50 mm
Peak Temperature240 °C
Lead Free Peak Temperature260 °C
FeaturesTop Exposed Pad
Package IndexQ64.10X10E

Moldel Line

Series: TQFP (16)

Manufacturer's Classification

  • Plastic Packages
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