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Package Intersil Q64.10x10H

Package Intersil Q64.10x10H

ManufacturerIntersil
SeriesTQFP
Part NumberQ64.10x10H

64 Lead Thin Plastic Quad Flatpack Package With Exposed Pad (EP-TQFP)

Package Outline Drawing (POD)

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    Plastic Packages for Integrated Circuits Package Outline Drawing
    Q64.10x10H
    64 LEAD THIN PLASTIC QUAD FLATPACK PACKAGE WITH EXPOSED PAD (EP-TQFP)
    Rev 0, 4/15
    12.00 4 5
    10.00 D 3 5.95 В±0.10 A 3 B 4 5
    5.95 В±0.10 10.00 12.00 3
    0
    M .39
    A 4
    X 0.50 EXPOSED PAD
    4X 4X 0.20 C A-B D 0.20 H A-B D TOP VIEW BOTTOM VIEW 1.20 MAX 11/13В°
    0.05 VALUE FOR THETA
    THETA 1 = 0В°
    THETA 2 = 11/13В°
    THETA 3 = 11/13В° / / 0.10 C
    0.08 SEE DETAIL "A" H C WITH LEAD FINISH 0.22 В±0.05 пЃ±1
    MIN 0.08
    0.08/0.2 2 1.2 MAX 1.0 В±0.05
    пЃ±3 0.08 M C A-B D 7 пЃ±2 0.1 В±0.05 0.25 0.2
    0.6 В±0.15 0.09/0.20 DETAIL "A"
    SCALE: NONE 0.09/0.16 1.00
    REF 0.20 В±0.03 ...

Parametrics

FamilyTQFP-EP
Pin Count64
Length10.00 mm
Width10.00 mm
Thickness0.99 mm
Weight0.35 g
Pitch0.51 mm
Peak Temperature240 °C
Lead Free Peak Temperature260 °C
FeaturesExposed Pad
Package IndexQ64.10X10H

Moldel Line

Series: TQFP (16)

Manufacturer's Classification

  • Plastic Packages
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