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Package Intersil Q64.10x10J

Package Intersil Q64.10x10J

ManufacturerIntersil
SeriesTQFP
Part NumberQ64.10x10J

64 LEAD THIN PLASTIC QUAD FLATPACK PACKAGE WITH EXPOSED PAD (EP-TQFP)

Package Outline Drawing (POD)

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    Plastic Packages for Integrated Circuits Package Outline Drawing
    Q64.10x10J
    64 LEAD THIN PLASTIC QUAD FLATPACK PACKAGE WITH EXPOSED PAD (EP-TQFP)
    Rev 0, 5/16
    12.00
    4 5
    10.00 D 3 EXPOSED PAD PIN 1
    0.10
    REF TYP.
    3 A 10.00
    12.00 7.30 В±0.15 4 5 B 0.50 3 4X 0.20 C A-B D 4X 0.20 H A-B D TOP VIEW
    7.30 В±0.15
    1.20 MAX 11/13В°
    0.05 BOTTOM VIEW
    // 0.10 C 0В° MIN. C
    0.08
    SEE DETAIL “A” SIDE VIEW 7 0.08 M C A-B H 2 1.00 ±0.05 D WITH LEAD FINISH 0.22 ±0.05 0.05/0.15
    0.09/0.16 0.09/0.20 0.08
    R. MIN
    0.20 MIN.
    DETAIL “A”
    SCALE: NONE 0.20 В±0.03 0-7В° 0.25
    GAUGE PLANE ...

Parametrics

FamilyTQFP-EP
Pin Count64
Thickness1.00 mm
Height max1.20 mm
Weight0.29 g
Pitch0.50 mm
Lead Free Peak Temperature260 °C
FeaturesExposed Pad
Package IndexQ64.10X10J

Moldel Line

Series: TQFP (16)

Manufacturer's Classification

  • Plastic Packages
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