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Package Intersil Q64.10x10K

ManufacturerIntersil
SeriesTQFP
Part NumberQ64.10x10K

64 LEAD THIN PLASTIC QUAD FLATPACK PACKAGE

Package Outline Drawing (POD)

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    Plastic Packages for Integrated Circuits Package Outline Drawing
    Q64.10x10K
    64 LEAD THIN PLASTIC QUAD FLATPACK PACKAGE
    Rev 0, 10/16
    12.00
    4 5
    10.00
    D 3
    Pin 1 A 3 12.00 10.00 4 5 B 0.50 3 0.20 C A-B D 4X 4X 0.20 H A-B D BOTTOM VIEW TOP VIEW 11/13° 1.20 MAX 0.05 0° MIN. / / 0.10 C 0.08 M C A-B 7 H 0.08
    C
    SEE DETAIL “A” SIDE VIEW D 0.1 MAX WITH LEAD FINISH 0.22 ±0.05 2 1.00 ±0.05 10° MAX 0.08
    R. MIN.
    0.20 MIN. 0.25
    GAUGE PLANE
    0.55 ±0.15 (1.00)
    0.09/0.20 0.09/0.16 DETAIL “A”
    SCALE: NONE 0.20 ±0.03 BASE METAL NOTES:
    1. All dimensioning and tolerancing conform to ANSI Y14.5-1982.
    2. Datum Plane H located at mold parting line and coincident with lead,
    where lead exits plastic body at bottom of parting line. (11.40) 3. Datums A-B and D to be determined at centerline between leads where
    leads exit plastic body at datum Plane H .
    4. Dimensions do not include mold protrusion. Allowable mold protrusion is
    0.254mm dimensions. ...

Parametrics

FamilyTQFP
Pin Count64
Thickness1.00 mm
Height max1.20 mm
Weight0.345 g
Pitch0.50 mm
Peak Temperature240 °C
Lead Free Peak Temperature260 °C
Package IndexQ64.10X10K

Moldel Line

Series: TQFP (16)

Manufacturer's Classification

  • Plastic Packages
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