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Package Intersil M14.173

Package Intersil M14.173

ManufacturerIntersil
SeriesTSSOP
Part NumberM14.173

14 Lead Thin Shrink Small Outline Package

Package Outline Drawing (POD)

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    Plastic Packages for Integrated Circuits Package Outline Drawing
    M14.173
    14 LEAD THIN SHRINK SMALL OUTLINE PACKAGE (TSSOP)
    Rev 3, 10/09
    A
    1 3 5.00 В±0.10
    SEE
    DETAIL "X" 8 14 6.40
    PIN #1
    I.D. MARK 4.40 В±0.10
    2 3 1 0.20 C B A 7
    B 0.65 0.09-0.20 TOP VIEW END VIEW 1.00 REF
    0.05 H
    C 0.90 +0.15/-0.10
    1.20 MAX SEATING
    PLANE
    0.25 +0.05/-0.06
    0.10 C 0.10 GAUGE
    PLANE 0.25 5
    0В°-8В° 0.05 MIN
    0.15 MAX CBA SIDE VIEW 0.60 В±0.15
    DETAIL "X" (1.45)
    NOTES: ...

Parametrics

FamilyTSSOP
Pin Count14
Length5.00 mm
Thickness0.90 mm
Height max1.20 mm
Weight0.054 g
Pitch0.65 mm
Package IndexM14.173

Moldel Line

Series: TSSOP (21)

Manufacturer's Classification

  • Plastic Packages
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