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Package Intersil M16.173

Package Intersil M16.173

ManufacturerIntersil
SeriesTSSOP
Part NumberM16.173

16 Lead Thin Shrink Small Outline Plastic Package

Package Outline Drawing (POD)

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    Plastic Packages for Integrated Circuits Package Outline Drawing
    M16.173
    16 LEAD THIN SHRINK SMALL OUTLINE PACKAGE (TSSOP)
    Rev 2, 5/10
    A
    1 3 5.00 В±0.10
    SEE DETAIL "X" 9 16 6.40
    PIN #1
    I.D. MARK 4.40 В±0.10
    2 3 0.20 C B A 1 8
    B 0.65 0.09-0.20
    END VIEW TOP VIEW 1.00 REF -0.05 H
    C 1.20 MAX SEATING
    PLANE 0.90 +0.15/-0.10
    GAUGE
    PLANE 0.25 +0.05/-0.06 5
    0.10 M C B A 0.10 C 0В°-8В° 0.05 MIN
    0.15 MAX SIDE VIEW 0.25 0.60 В±0.15
    DETAIL "X" (1.45)
    NOTES:
    1. Dimension does not include mold flash, protrusions or gate burrs. (5.65) Mold flash, protrusions or gate burrs shall not exceed 0.15 per side.
    2. Dimension does not include interlead flash or protrusion. Interlead
    flash or protrusion shall not exceed 0.25 per side. ...

Parametrics

FamilyTSSOP
Pin Count16
Length5.00 mm
Thickness0.90 mm
Height max1.20 mm
Weight0.054 g
Pitch0.65 mm
Peak Temperature240 °C
Lead Free Peak Temperature260 °C
Package IndexM16.173

Moldel Line

Series: TSSOP (21)

Manufacturer's Classification

  • Plastic Packages
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