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Package Intersil M16.173A

Package Intersil M16.173A

ManufacturerIntersil
SeriesTSSOP
Part NumberM16.173A

16 LEAD HEATSINK THIN SHRINK SMALL OUTLINE PACKAGE (HTSSOP)

Package Outline Drawing (POD)

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    Plastic Packages for Integrated Circuits Package Outline Drawing
    M16.173A
    16 LEAD HEATSINK THIN SHRINK SMALL OUTLINE PACKAGE (HTSSOP)
    Rev 1, 2/15
    A
    1 3
    3.00 В±0.10 5.00 В±0.10 SEE DETAIL "X" 9 16 PIN #1
    I.D. MARK 6.40
    4.40 В±0.10
    2 3.00 В±0.10 3 0.20 C B A 1 8
    B 0.65 EXPOSED THERMAL PAD 0.09 TO 0.20
    END VIEW TOP VIEW BOTTOM VIEW -0.05 H 1.00 REF
    C
    1.20 MAX SEATING
    PLANE 0.90 +0.15/-0.10
    GAUGE
    PLANE 0.25 +0.05/-0.06 5
    0.10 M C B A 0.10 C 0.25 0В°-8В°
    0.05 MIN
    0.15 MAX SIDE VIEW 0.60 В±0.15 DETAIL "X" (1.45)
    NOTES: (5.65) ( 3.00) 1. Dimension does not include mold flash, protrusions or gate burrs.
    Mold flash, protrusions or gate burrs shall not exceed 0.15 per side.
    2. Dimension does not include interlead flash or protrusion. Interlead ...

Parametrics

FamilyTSSOP-EP
Pin Count16
Length5.00 mm
Thickness0.90 mm
Height max1.20 mm
Weight0.054 g
Pitch0.65 mm
Peak Temperature240 °C
Lead Free Peak Temperature260 °C
FeaturesExposed Pad
Package IndexM16.173A

Moldel Line

Series: TSSOP (21)

Manufacturer's Classification

  • Plastic Packages

Related datasheets:

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