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Package Intersil M20.173

Package Intersil M20.173

ManufacturerIntersil
SeriesTSSOP
Part NumberM20.173

20 Lead Thin Shrink Small Outline Plastic Package

Package Outline Drawing (POD)

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    Plastic Packages for Integrated Circuits Package Outline Drawing
    M20.173
    20 LEAD THIN SHRINK SMALL OUTLINE PACKAGE (TSSOP)
    Rev 2, 5/10
    A
    1 3 6.50 В±0.10 6.40 PIN #1
    I.D. MARK 4.40 В±0.10
    2 SEE DETAIL "X" 10 20 3 0.20 C B A 1 9
    B 0.65 0.09-0.20 TOP VIEW END VIEW 1.00 REF
    H -0.05 C
    0.90 +0.15/-0.10
    1.20 MAX SEATING
    PLANE GAUGE
    PLANE
    0.25 +0.05/-0.06 5
    0.10 M C B A 0.10 C 0В°-8В° 0.05 MIN
    0.15 MAX SIDE VIEW 0.25 0.60 В±0.15
    DETAIL "X" (1.45)
    NOTES:
    1. Dimension does not include mold flash, protrusions or gate burrs. (5.65) Mold flash, protrusions or gate burrs shall not exceed 0.15 per side.
    2. Dimension does not include interlead flash or protrusion. Interlead
    flash or protrusion shall not exceed 0.25 per side.
    3. Dimensions are measured at datum plane H. ...

Parametrics

FamilyTSSOP
Pin Count20
Length6.50 mm
Thickness0.90 mm
Height max1.20 mm
Weight0.072 g
Pitch0.65 mm
Lead Free Peak Temperature260 °C
Package IndexM20.173

Moldel Line

Series: TSSOP (21)

Manufacturer's Classification

  • Plastic Packages
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