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Package Intersil M24.173

Package Intersil M24.173

ManufacturerIntersil
SeriesTSSOP
Part NumberM24.173

24 Lead Thin Shrink Small Outline Plastic Package

Package Outline Drawing (POD)

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    Plastic Packages for Integrated Circuits Package Outline Drawing
    M24.173
    24 LEAD THIN SHRINK SMALL OUTLINE PACKAGE (TSSOP)
    Rev 1, 5/10
    A
    1 3 7.80 В±0.10
    SEE DETAIL "X" 13 24 6.40
    PIN #1
    I.D. MARK 4.40 В±0.10
    2 3 0.20 C B A 1 12
    0.15 +0.05
    -0.06 B 0.65
    TOP VIEW END VIEW 1.00 REF
    H -0.05 C 0.90 +0.15
    -0.10
    1.20 MAX GAUGE
    PLANE SEATING PLANE
    0.25 +0.05
    -0.06
    0.10 M C B A 0.10 C 5 0В°-8В° 0.05 MIN
    0.15 MAX SIDE VIEW 0.25 0.60В± 0.15 DETAIL "X" (1.45)
    NOTES:
    1. Dimension does not include mold flash, protrusions or gate burrs. ...

Parametrics

FamilyTSSOP
Pin Count24
Length7.80 mm
Thickness0.90 mm
Height max1.20 mm
Weight0.09 g
Pitch0.65 mm
Package IndexM24.173

Moldel Line

Series: TSSOP (21)

Manufacturer's Classification

  • Plastic Packages
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