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Package Intersil M24.173B

Package Intersil M24.173B

ManufacturerIntersil
SeriesTSSOP
Part NumberM24.173B

24 Lead Thin Shrink Small Outline Plastic Package

Package Outline Drawing (POD)

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    Plastic Packages for Integrated Circuits
    Thin Shrink Small Outline Exposed Pad Plastic Packages (EPTSSOP)
    M24.173B
    24 LEAD THIN SHRINK SMALL OUTLINE EXPOSED PAD
    PLASTIC PACKAGE N
    INDEX
    AREA E 0.25(0.010) M 2 A
    L 0.05(0.002)
    -A-A D О±
    A2
    c e A1 b
    0.10(0.004) M 0.25
    0.010 SEATING PLANE -C-2 SYMBOL 3
    TOP VIEW 1 INCHES GAUGE
    PLANE -B1 B M E1 0.10(0.004)
    C A M MIN 3 NOTES 0.047 -1.20 -0.006 0.00 0.15 -A2 0.031 0.051 0.80 1.05 -b 0.0075 0.0118 0.19 0.30 9 c 0.0035 0.0079 0.09 0.20 -D 0.303 0.311 7.70 7.90 3 E1 0.169 0.177 4.30 4.50 4 0.026 BSC 0.65 BSC -E 0.246 0.256 6.25 6.50 -L 0.0177 0.0295 0.45 0.75 6 О± 0o 8o 0o 8o -P -0.197 -5.00 11 P1 -0.126 -3.20 NOTES: P1 MAX 0.000 e -MIN A1 N B S MILLIMETERS MAX 24 24 7 11
    Rev. 1 11/03 1. These package dimensions are within allowable dimensions of
    JEDEC MO-153-ADT, Issue F.
    2. Dimensioning and tolerancing per ANSI Y14.5M-1982.
    3. Dimension “D” does not include mold flash, protrusions or gate
    burrs. Mold flash, protrusion and gate burrs shall not exceed
    0.15mm (0.006 inch) per side.
    4. Dimension “E1” does not include interlead flash or protrusions. ...

Parametrics

FamilyTSSOP-EP
Pin Count24
Length7.80 mm
Thickness0.92 mm
Height max1.20 mm
Weight0.09 g
Pitch0.65 mm
Peak Temperature240 °C
Lead Free Peak Temperature260 °C
FeaturesExposed Pad
Package IndexM24.173B

Moldel Line

Series: TSSOP (21)

Manufacturer's Classification

  • Plastic Packages
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