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Package Intersil M24.173C

Package Intersil M24.173C

ManufacturerIntersil
SeriesTSSOP
Part NumberM24.173C

24 Lead Heat-sink Thin Shrink Small Outline Package (HTSSOP)

Package Outline Drawing (POD)

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    Plastic Packages for Integrated Circuits Package Outline Drawing
    M24.173C
    24 LEAD HEAT-SINK THIN SHRINK SMALL OUTLINE PACKAGE (HTSSOP)
    Rev 1, 12/09
    A
    1 3
    4.30 В±0.10 7.80 В±0.10
    SEE
    DETAIL "X" 13 24 6.40
    PIN #1
    I.D. MARK 4.40 В±0.10
    2
    3 1 3.00 В±0.10 12 0.20 C B A B 0.65 EXPOSED THERMAL PAD 0.09-0.20
    END VIEW TOP VIEW H BOTTOM VIEW 1.00 REF 0.05 C
    0.90 +0.15/-0.10 1.20 MAX GAUGE
    PLANE SEATING PLANE
    0.19 -0 .30
    0.10 C 0.10 5 CBA 0В°-8В°
    0.60 В±0.15 0.00 MIN
    0.10 MAX SIDE VIEW 0.25 DETAIL "X" (4.30) (1.45) (5.65) (3.00) NOTES:
    1. Dimension does not include mold flash, protrusions or gate burrs.
    Mold flash, protrusions or gate burrs. Mold flash, protrusions or
    gate burrs shall not exceed 0.15 per side. ...

Parametrics

FamilyTSSOP-EP
Pin Count24
Length7.80 mm
Height max1.05 mm
Weight0.09 g
Pitch0.65 mm
Peak Temperature240 °C
Lead Free Peak Temperature260 °C
FeaturesExposed Pad
Package IndexM24.173C

Moldel Line

Series: TSSOP (21)

Manufacturer's Classification

  • Plastic Packages
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