Package Intersil M24.173C

ManufacturerIntersil
SeriesTSSOP
Part NumberM24.173C
Package Intersil M24.173C

24 Lead Heat-sink Thin Shrink Small Outline Package (HTSSOP)

Package Outline Drawing (POD)

PDF, 57 Kb
Docket

Parametrics

FamilyTSSOP-EP
Pin Count24
Length7.80 mm
Height max1.05 mm
Weight0.09 g
Pitch0.65 mm
Peak Temperature240 °C
Lead Free Peak Temperature260 °C
FeaturesExposed Pad
Package IndexM24.173C

Model Line

Manufacturer's Classification