RadioLocman.com Electronics ru
Advanced Search +
  

Package Intersil M38.173

Package Intersil M38.173

ManufacturerIntersil
SeriesTSSOP
Part NumberM38.173

38 Lead Thin Shrink Small Outline Plastic Package

Package Outline Drawing (POD)

  • Download » PDF, 32 Kb
    Docket ↓
    Plastic Packages for Integrated Circuits
    Thin Shrink Small Outline Plastic Packages (TSSOP)
    M38.173 N
    INDEX
    AREA E 0.25(0.010) M E1 2 INCHES GAUGE
    PLANE -B1 38 LEAD THIN SHRINK SMALL OUTLINE PLASTIC PACKAGE
    (COMPLIANT TO JEDEC MO-153-BD-1 ISSUE F) B M SYMBOL
    A 3 A1 L
    0.05(0.002)
    -A-A D
    -C-e α
    A2 A1 b
    0.10(0.004) M 0.25
    0.010 SEATING PLANE c
    0.10(0.004) C A M B S MIN
    0.002 1. These package dimensions are within allowable dimensions of
    JEDEC MO-153-BD-1, Issue F.
    2. Dimensioning and tolerancing per ANSI Y14.5M-1982.
    3. Dimension “D” does not include mold flash, protrusions or gate burrs.
    Mold flash, protrusion and gate burrs shall not exceed 0.15mm
    (0.006 inch) per side.
    4. Dimension “E1” does not include interlead flash or protrusions. Interlead flash and protrusions shall not exceed 0.15mm (0.006 inch) per
    side. ...

Parametrics

FamilyTSSOP
Pin Count38
Length9.70 mm
Thickness0.92 mm
Height max1.20 mm
Weight0.11 g
Pitch0.50 mm
Peak Temperature240 °C
Lead Free Peak Temperature260 °C
Package IndexM38.173

Moldel Line

Series: TSSOP (21)

Manufacturer's Classification

  • Plastic Packages
Slices ↓
Radiolocman facebook Radiolocman twitter Radiolocman google plus