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Package Intersil M38.173B

Package Intersil M38.173B

ManufacturerIntersil
SeriesTSSOP
Part NumberM38.173B

38 Lead Thin Shrink Small Outline Exposed Pad Plastic Package

Package Outline Drawing (POD)

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    Plastic Packages for Integrated Circuits
    Thin Shrink Small Outline Exposed Pad Plastic Packages (EPTSSOP)
    N M38.173B INDEX
    AREA E 0.25(0.010) M E1 2 38 LEAD THIN SHRINK SMALL OUTLINE PLASTIC PACKAGE
    INCHES GAUGE
    PLANE -B1 B M SYMBOL
    A 3
    TOP VIEW 0.25
    0.010 0.05(0.002)
    -A-L SEATING PLANE
    A D О± -C-A2
    c e A1 b
    0.10(0.004) M 0.10(0.004)
    C A M 2 -3 MIN MAX NOTES 0.047 -1.20 -0.002 0.006 0.05 0.15 -A2 0.031 0.051 0.80 1.05 -b 0.0075 0.0106 0.17 0.27 9 c 0.0035 0.0079 0.09 0.20 -D 0.378 0.386 9.60 9.80 3 E1 0.169 0.177 4.30 4.50 4 e 0.0197 BSC 0.500 BSC -E 0.246 0.256 6.25 6.50 -L 0.0177 0.0295 0.45 0.75 6 8o 0o N B S MILLIMETERS MAX A1 О±
    1 MIN 38
    0o 38 7
    8o -P -0.256 -6.5 11 P1 -0.126 -3.2 11
    Rev. 0 9/06 P1 NOTES:
    1. These package dimensions are within allowable dimensions of
    JEDEC MO-153-BD-1, Issue F. N 2. Dimensioning and tolerancing per ANSI Y14.5M-1982. P 3. Dimension “D” does not include mold flash, protrusions or gate
    burrs. Mold flash, protrusion and gate burrs shall not exceed
    0.15mm (0.006 inch) per side. BOTTOM VIEW 4. Dimension “E1” does not include interlead flash or protrusions.
    Interlead flash and protrusions shall not exceed 0.15mm (0.006 ...

Parametrics

FamilyTSSOP-EP
Pin Count38
Length9.70 mm
Thickness0.92 mm
Height max1.20 mm
Weight0.11 g
Pitch0.50 mm
Peak Temperature240 °C
Lead Free Peak Temperature260 °C
FeaturesExposed Pad
Package IndexM38.173B

Moldel Line

Series: TSSOP (21)

Manufacturer's Classification

  • Plastic Packages

Related datasheets:

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