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Package Intersil M38.173C

Package Intersil M38.173C

ManufacturerIntersil
SeriesTSSOP
Part NumberM38.173C

38 Lead Heat-Sink Thin Shrink Small Outline Plastic Package (HTSSOP)

Package Outline Drawing (POD)

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    Plastic Packages for Integrated Circuits Package Outline Drawing
    M38.173C
    38 LEAD HEAT-SINK THIN SHRINK SMALL OUTLINE PLASTIC PACKAGE (HTSSOP)
    Rev 0, 4/10
    PIN 1 ID B 4.6В±0.10
    0.09-0.20 D
    3 2 1 12 3 C
    L 6.4 3.20В±0.10 4.4В±0.10
    4 38 0.17-0.27 A 0.20 C A-B D
    2X N/2 TIPS
    0.08 M C A-B D 5 SEE
    DETAIL "A" EXPOSED PAD VIEW END VIEW TOP VIEW
    (14В°) TYP (1.00) 1.10 MAX
    0.05 C 0.90В±0.05
    0.25 C PARTING
    LINE 0.10 C
    0.50 0.05/0.15 9.70В±0.10 4 SEATING
    PLANE SIDE VIEW H 3
    (0-8В°) 0.6В±0.10
    DETAIL "A" SCALE: 30/1
    (VIEW ROTATED 90В°C.W.) (4.60) NOTES:
    1. Die thickness allowable is 0.279В±0.0127 (0.0110В±0.0005 inches).
    2. Dimensioning & tolerances per ASME. Y14.5m-1994. ...

Parametrics

FamilyTSSOP-EP
Pin Count38
Length9.70 mm
Height max1.10 mm
Weight0.11 g
Pitch0.50 mm
Peak Temperature240 °C
Lead Free Peak Temperature260 °C
FeaturesExposed Pad
Package IndexM38.173C

Moldel Line

Series: TSSOP (21)

Manufacturer's Classification

  • Plastic Packages

Related datasheets:

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