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Package Intersil M48.240

Package Intersil M48.240

ManufacturerIntersil
SeriesTSSOP
Part NumberM48.240

48 LEAD THIN SHRINK SMALL OUTLINE PACKAGE (TSSOP)

Package Outline Drawing (POD)

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    Plastic Packages for Integrated Circuits Package Outline Drawing
    M48.240 48 LEAD THIN SHRINK SMALL OUTLINE PACKAGE (TSSOP)
    Rev 1, 11/10
    0.50 B 0.09-0.20 48 8.1 C
    L 6.1В±0.10
    4 0.20 C A B
    2X N/2 TIPS 123
    PIN 1 ID 0.17-0.27 SEE
    DETAIL "A" 0.08 M C A B 5 BOTTOM VIEW TOP VIEW A 1.10 MAX
    0.90В±0.05 0.05 (1.45) C 12.50В±0.10 (7.35) 0.05/0.15 4 0.10 C
    SEATING
    PLANE SIDE VIEW (12В°) TYP (1.00)
    (46X 0.50) (48X 0.28)
    0.25 PARTING
    LINE TYPICAL RECOMMENDED LAND PATTERN H 3
    (0-8В°) 0.6В±0.15
    DETAIL "A"
    SCALE: (NONE)
    (VIEW ROTATED 90В° C.W.) NOTES:
    1. All dimensions are in millimeters (angles in degrees).
    2. Dimensioning & tolerances per ASME. Y14.5m-1994.
    3. Datum plane H located at mold parting line and coincident
    with lead where lead exits plastic body at bottom of parting line. ...

Parametrics

FamilyTSSOP
Pin Count48
Length12.50 mm
Width6.10 mm
Height max11.00 mm
Weight0.173 g
Peak Temperature240 °C
Lead Free Peak Temperature260 °C
Package IndexM48.240

Moldel Line

Series: TSSOP (21)

Manufacturer's Classification

  • Plastic Packages
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