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Package Intersil MDP0044

Package Intersil MDP0044

ManufacturerIntersil
SeriesTSSOP
Part NumberMDP0044

TSSOP Thin-Shrink Small Outline Package Family

Package Outline Drawing (POD)

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    Plastic Packages for Integrated Circuits
    Thin Shrink Small Outline Package Family (TSSOP)
    MDP0044 0.25 M C A B
    D THIN SHRINK SMALL OUTLINE PACKAGE FAMILY A
    (N/2)+1 N MILLIMETERS
    SYMBOL 14 LD 16 LD 20 LD 24 LD 28 LD TOLERANCE
    PIN #1 I.D. E E1 1 (N/2) B 0.20 C B A
    2X
    N/2 LEAD TIPS TOP VIEW 0.05 e C
    SEATING
    PLANE H A 1.20 1.20 1.20 1.20 1.20 Max A1 0.10 0.10 0.10 0.10 0.10 В±0.05 A2 0.90 0.90 0.90 0.90 0.90 В±0.05 b 0.25 0.25 0.25 0.25 0.25 +0.05/-0.06 c 0.15 0.15 0.15 0.15 0.15 +0.05/-0.06 D 5.00 5.00 6.50 7.80 9.70 В±0.10 E 6.40 6.40 6.40 6.40 6.40 Basic E1 4.40 4.40 4.40 4.40 4.40 В±0.10 e 0.65 0.65 0.65 0.65 0.65 Basic L 0.60 0.60 0.60 0.60 0.60 В±0.15 L1 1.00 1.00 1.00 1.00 1.00 Reference
    Rev. F 2/07 0.10 M C A B b
    0.10 C
    N LEADS SIDE VIEW NOTES:
    1. Dimension “D” does not include mold flash, protrusions or gate
    burrs. Mold flash, protrusions or gate burrs shall not exceed
    0.15mm per side.
    2. Dimension “E1” does not include interlead flash or protrusions.
    Interlead flash and protrusions shall not exceed 0.25mm per
    side. SEE DETAIL “X” 3. Dimensions “D” and “E1” are measured at dAtum Plane H.
    4. Dimensioning and tolerancing per ASME Y14.5M-1994. c END VIEW L1 A A2
    GAUGE
    PLANE ...

Parametrics

FamilyTSSOP
Thickness0.90 mm
Height max1.20 mm
Pitch0.65 mm
Package IndexMDP0044

Moldel Line

Series: TSSOP (21)

Manufacturer's Classification

  • Plastic Packages

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