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Package Intersil MDP0048

ManufacturerIntersil
SeriesTSSOP
Part NumberMDP0048

HTSSOP Heatsink TSSOP Package Family

Package Outline Drawing (POD)

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    Plastic Packages for Integrated Circuits
    HTSSOP (Heat-Sink TSSOP) Family
    MDP0048 0.25 M C A B
    D HTSSOP (HEAT-SINK TSSOP) FAMILY A
    (N/2)+1 N MILLIMETERS
    SYMBOL 14 LD 20 LD 24 LD 28 LD 38 LD TOLERANCE
    PIN #1 I.D. E E1 1 0.20 C B A
    2X
    N/2 LEAD TIPS (N/2)
    TOP VIEW B D1 EXPOSED
    THERMAL PAD E2 1.20 1.20 1.20 1.20 Max 0.075 0.075 0.075 0.075 ±0.075 A2 0.90 0.90 0.90 0.90 0.90 +0.15/-0.10 b 0.25 0.25 0.25 0.25 0.22 +0.05/-0.06 c 0.15 0.15 0.15 0.15 0.15 +0.05/-0.06 D 5.00 6.50 7.80 9.70 9.70 ±0.10 D1 3.2 4.2 4.3 5.0 7.25 Reference E 6.40 6.40 6.40 6.40 6.40 Basic E1 4.40 4.40 4.40 4.40 4.40 ±0.10 E2 3.0 3.0 3.0 3.0 3.0 Reference e 0.65 0.65 0.65 0.65 0.50 Basic L 0.60 0.60 0.60 0.60 0.60 ±0.15 L1 1.00 1.00 1.00 1.00 1.00 Reference N 14 20 24 28 38 Reference NOTES: 0.05 e 1.20
    0.075 Rev. 3 2/07 BOTTOM VIEW C A
    A1 H 1. Dimension “D” does not include mold flash, protrusions or gate
    burrs. Mold flash, protrusions or gate burrs shall not exceed
    0.15mm per side.
    2. Dimension “E1” does not include interlead flash or protrusions.
    Interlead flash and protrusions shall not exceed 0.25mm per
    side. SEATING
    PLANE
    0.10 C
    N LEADS 3. Dimensions “D” and “E1” are measured at Datum Plane H. 0.10 M C A B b 4. Dimensioning and tolerancing per ASME Y14.5M-1994. SIDE VIEW SEE DETAIL “X” c END VIEW L1
    A A2 GAUGE
    PLANE ...

Parametrics

FamilyTSSOP-EP
FeaturesExposed Pad
Package IndexMDP0048

Moldel Line

Series: TSSOP (21)

Manufacturer's Classification

  • Plastic Packages

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