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Package Intersil L16.5x5D

Package Intersil L16.5x5D

ManufacturerIntersil
SeriesWFQFN
Part NumberL16.5x5D

16 LEAD QUAD FLAT NO-LEAD PLASTIC PACKAGE (PUNCH QFN WITH WETTABLE FLANK)

Package Outline Drawing (POD)

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    Plastic Packages for Integrated Circuits Package Outline Drawing
    L16.5x5D
    16 LEAD QUAD FLAT NO-LEAD PLASTIC PACKAGE (PUNCH QFN WITH WETTABLE FLANK)
    Rev 2, 5/14
    0.10 M C A B 2.8
    A 0.10 C A (2X) 5.00 0.60 MAX. (4X)
    PIN 1 ID
    R0.20 4.75
    16 16 0.10 C B (2X)
    0.60 MAX. (4X) 0.45
    0.10 M C B A 1 5
    0.50 DIA 1
    5.00 2 2
    2.8 4.75 3 3
    (0.70)
    CC (2X) 0.10 C B (2X) 0.40В±0.10
    0.15В±0.10 0.10 C A
    B TOP VIEW TERMINAL TIP 4
    0.30В±0.05
    0.10 M C A B
    0.05 M C (0.70) 0.08 C // 0.10 C
    0.85 В± 0.05 0.80 5 BOTTOM VIEW + 0.04
    0.01 -0.01 0.65 В± 0.05 ...

Parametrics

FamilyWFQFN
Pin Count16
Length5.00 mm
Width5.00 mm
Thickness0.85 mm
Height max0.90 mm
Weight0.094 g
Pitch0.80 mm
Peak Temperature240 °C
Lead Free Peak Temperature260 °C
Package IndexL16.5X5D

Moldel Line

Series: WFQFN (7)

Manufacturer's Classification

  • Plastic Packages
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