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Package Intersil W11x11.121

Package Intersil W11x11.121

ManufacturerIntersil
SeriesWLCSP
Part NumberW11x11.121

121 BALL WAFER LEVEL CHIP SCALE PACKAGE (WLCSP 0.5mm Pitch)

Package Outline Drawing (POD)

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    Plastic Packages for Integrated Circuits Package Outline Drawing
    W11x11.121
    121 BALL WAFER LEVEL CHIP SCALE PACKAGE (WLCSP 0.5mm Pitch)
    Rev 2, 9/13
    5.455В±0.030 5.000 X 0.500
    Y 121x 0.320В±0.030
    L
    K
    J
    H
    G 5.535В±0.030 5.000 F
    E
    D
    C
    B
    A (4x) 0.10 1
    PIN 1 2 3 4 5 6 7 9 8 10 11 0.2675
    0.2275 0.500 TOP VIEW BOTTOM VIEW 0.05 Z Z SEATING PLANE PACKAGE OUTLINE
    0.330 0.500 0.320В±0.030 121x
    0.10 M Z X Y
    0.05 M Z
    0.280 3 NSMD
    TYPICAL RECOMMENDED LAND PATTERN 0.240В±0.030 ...
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