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Package Intersil W13x13.169

ManufacturerIntersil
SeriesWLCSP
Part NumberW13x13.169

169 BALL WAFER LEVEL CHIP SCALE PACKAGE (WLCSP 0.4mm Pitch)

Package Outline Drawing (POD)

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    Plastic Packages for Integrated Circuits Package Outline Drawing
    W13x13.169
    169 BALL WAFER LEVEL CHIP SCALE PACKAGE (WLCSP 0.4mm pitch)
    Rev 1, 9/16
    X 0.400 5.609 В±0.030 Y N
    169x 0.265 В±0.035 M
    L
    K
    J
    H
    G 5.609 В±0.030 F
    E
    D
    C
    0.405 B
    A
    (4x) 0.10
    TOP VIEW PIN 1
    (A1 CORNER) 1 2 3 4 5 9 10 11 12 13 6 7 8 0.400 0.405 BOTTOM VIEW 0.05 Z Z SEATING PLANE
    3 PACKAGE OUTLINE 0.215 0.400 0.265 В±0.035 4
    0.10
    Z X Y
    Z ...
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