Package Intersil W3x2.6

ManufacturerIntersil
SeriesWLCSP
Part NumberW3x2.6
Package Intersil W3x2.6

3x2 Array 6 Ball Wafer Level Chip Scale Package (WLSCP 0.4mm Pitch)

Package Outline Drawing (POD)

PDF, 105 Kb
Docket

Parametrics

FamilyWLCSP-BP
Pin Count6
Length0.80 mm
Width1.36 mm
Height max0.55 mm
Weight0.00168 g
Pitch0.40 mm
Lead Free Peak Temperature260 °C
Package IndexW3X2.6

Model Line

Manufacturer's Classification