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Package Intersil W3x2.6

Package Intersil W3x2.6

ManufacturerIntersil
SeriesWLCSP
Part NumberW3x2.6

3x2 Array 6 Ball Wafer Level Chip Scale Package (WLSCP 0.4mm Pitch)

Package Outline Drawing (POD)

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    Plastic Packages for Integrated Circuits Package Outline Drawing
    W3x2.6
    3X2 ARRAY 6 BALL WAFER LEVEL CHIP SCALE PACKAGE (WLSCP 0.4MM PITCH)
    Rev 3, 1/13 X
    1.360В±0.03 Y 0.280
    0.200 0.800
    2 0.800В±0.03
    0.10
    PIN 1
    (A1 CORNER) 1 0.400 0.200
    A
    B
    6X 0.265В±0.035 C TOP VIEW BOTTOM VIEW PACKAGE
    OUTLINE
    4
    0.240
    0.400 SEATING PLANE
    3 0.10
    0.05 2 0.200В±0.030 0.05 Z
    0.290
    6 0.500В±0.050 NSMD TYPICAL RECOMMENDED LAND PATTERN SIDE VIEW NOTES:
    1. Dimensions and tolerance per ASME Y 14.5M -1994.
    2. Dimension is measured at the maximum bump diameter ...
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