Package Intersil W3x3.9D

ManufacturerIntersil
SeriesWLCSP
Part NumberW3x3.9D
Package Intersil W3x3.9D

3x3 Array 9 Balls with 0.40 Pitch Wafer Level Chip Scale Package (With BSC)

Package Outline Drawing (POD)

PDF, 53 Kb
Docket

Parametrics

FamilyWLCSP-BPBC
Pin Count9
Length1.45 mm
Width1.45 mm
Height max0.59 mm
Weight0.002714 g
Pitch0.40 mm
Lead Free Peak Temperature260 °C
Package IndexW3X3.9D

Model Line

Manufacturer's Classification