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Package Intersil W3x3.9D

Package Intersil W3x3.9D

ManufacturerIntersil
SeriesWLCSP
Part NumberW3x3.9D

3x3 Array 9 Balls with 0.40 Pitch Wafer Level Chip Scale Package (With BSC)

Package Outline Drawing (POD)

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    Plastic Packages for Integrated Circuits Package Outline Drawing
    W3x3.9D
    3x3 ARRAY 9 BALLS WITH 0.40 PITCH WAFER LEVEL CHIP SCALE PACKAGE (WITH BSC)
    Rev 0, 1/14 X Y 1.410 В± 0.030 0.400 C
    9 x 0.265 В± 0.035 1.410 В± 0.030 B
    0.305
    A (4X) 0.10
    1
    TOP VIEW 2 3 PIN 1
    (A1 CORNER) 0.305
    BOTTOM VIEW Z
    0.05 SEATING PLANE Z 3 PACKAGE OUTLINE 0.240 0.040BSC
    (BACK SIDE COATING) 0.400 0.265 В± 0.035 0.290 RECOMMENDED LAND PATTERN 0.10 Z X Y 0.05 Z 0.200 В± 0.030
    0.540 В± 0.050
    SIDE VIEW NOTES:
    1. All dimensions are in millimeters.
    2. Dimension and tolerance per ASMEY 14.5 -1994,
    and JESD 95-1 SPP-010.
    3. NSMD refers to Non-Solder Mask Defined pad design per
    Intersil Tech Brief TB451 located at:
    http://www.intersil.com/content/dam/Intersil/documents/
    tb45/tb451.pdf 1 ...
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