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Package Intersil W3x3.9E

Package Intersil W3x3.9E

ManufacturerIntersil
SeriesWLCSP
Part NumberW3x3.9E

3x3 ARRAY 9 BALLS WITH 0.40 PITCH WAFER LEVEL CHIP SCALE PACKAGE

Package Outline Drawing (POD)

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    Plastic Packages for Integrated Circuits Package Outline Drawing
    W3x3.9E
    3x3 ARRAY 9 BALLS WITH 0.40 PITCH WAFER LEVEL CHIP SCALE PACKAGE
    Rev 0, 8/14 X Y 1.410 В± 0.030 0.400 C
    9 x 0.265 В± 0.035 1.410 В± 0.030 B
    0.305
    A (4X) 0.10
    1
    TOP VIEW 2 3 PIN 1
    (A1 CORNER) 0.305
    BOTTOM VIEW Z
    0.05 SEATING PLANE Z 3 PACKAGE OUTLINE 0.240 0.400 0.265 В± 0.035 0.290 RECOMMENDED LAND PATTERN 0.200 В± 0.030
    0.500 В± 0.050
    SIDE VIEW NOTES:
    1. All dimensions are in millimeters.
    2. Dimensions and tolerance per ASMEY 14.5 -1994, and JESD 95-1 SPP-010.
    3. NSMD refers to non-solder mask defined pad design per Intersil Techbrief TB451. 1 0.10 Z X Y 0.05 Z ...
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