Package Intersil W3x3.9F

ManufacturerIntersil
SeriesWLCSP
Part NumberW3x3.9F
Package Intersil W3x3.9F

9 Ball 3x3 Array Thin Wafer Level Chip Scale Package (WLCSP 0.4mm Pitch)

Package Outline Drawing (POD)

PDF, 140 Kb
Docket

Parametrics

FamilyWLCSP-BP
Pin Count9
Length1.45 mm
Width1.45 mm
Height max0.40 mm
Pitch0.40 mm
Lead Free Peak Temperature260 °C
Package IndexW3X3.9F

Model Line

Manufacturer's Classification