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Package Intersil W3x3.9F

ManufacturerIntersil
SeriesWLCSP
Part NumberW3x3.9F

9 Ball 3x3 Array Thin Wafer Level Chip Scale Package (WLCSP 0.4mm Pitch)

Package Outline Drawing (POD)

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    Plastic Packages for Integrated Circuits Package Outline Drawing
    W3x3.9F
    9 BALL 3x3 ARRAY THIN WAFER LEVEL CHIP SCALE PACKAGE (WLCSP 0.4mm Pitch)пЂ 
    Rev 0, 3/16 X
    1.410 В±0.030 Y 0.400 C
    1.410 В±0.030 9x 0.265 В± 0.035 B 0.305 A
    (4X) 0.10
    1
    TOP VIEW 2 3 PIN 1
    (A1 CORNER) 0.305
    BOTTOM VIEW Z
    0.05 Z SEATING PLANE
    3 PACKAGE OUTLINE 0.240 0.265 В±0.035 0.10 M Z X Y
    0.05 M Z 0.400
    0.290 0.200 В±0.030
    0.403 В±0.050
    RECOMMENDED LAND PATTERN SIDE VIEW NOTES:
    1. All dimensions are in millimeters.
    2. Dimensions and tolerance per ASMEY 14.5 -1994, and JESD 95-1 SPP-010.
    3. NSMD refers to non-solder mask defined pad design per Intersil Techbrief TB451. 1 ...
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